{\rtf1\ansi\deff0\deftab360 {\fonttbl {\f0\fswiss\fcharset0 Arial} {\f1\froman\fcharset0 Times New Roman} {\f2\fswiss\fcharset0 Verdana} {\f3\froman\fcharset2 Symbol} } {\colortbl; \red0\green0\blue0; } {\info {\author Biblio}{\operator }{\title Biblio RTF Export}} \f1\fs24 \paperw11907\paperh16839 \pgncont\pgndec\pgnstarts1\pgnrestart Pathak, A, Shen J-W, Usman M, Wei L-F, Mendiratta S, Chang Y-S, Sainbileg B, Ngue C-M, Chen R-S, Hayashi M, Luo T-T, Chen F-R, Chen K-H, Tseng T-W, Chen L-C, Lu K-L.? 2019.??Integration of a (?Cu?S?)n plane in a metal?organic framework affords high electrical conductivity, 2019. 10(1):1721.\par \par }